Download e-book for kindle: Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

By Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

CMP and sprucing are the main certain strategies used to complete the surfaces of mechanical and digital or semiconductor elements. Advances in CMP/Polishing applied sciences for Manufacture of digital units offers the most recent advancements and technological concepts within the box – making state of the art R&D obtainable to the broader engineering group.

Most of the functions of those approaches are saved as private as attainable (proprietary information), and particular info are usually not obvious in specialist or technical journals and magazines. This publication makes those approaches and functions obtainable to a much wider business and educational audience.

Building at the basics of tribology – the technological know-how of friction, put on and lubrication – the authors discover the sensible purposes of CMP and sharpening throughout a variety of marketplace sectors. as a result of excessive velocity of improvement of the electronics and semiconductors undefined, some of the offered approaches and purposes come from those industries.

  • Demystifies medical advancements and technological recommendations, beginning them up for brand spanking new purposes and procedure advancements within the semiconductor and different parts of precision engineering
  • Explores inventory elimination mechanisms in CMP and sprucing, and the demanding situations serious about predicting the results of abrasive approaches in high-precision environments
  • The authors compile the newest concepts and study from the united states and Japan

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Advances in CMP Polishing Technologies by Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa

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